Analysis of optimum dispatching policies for semiconductor fabrication
International Postgraduate Conference On Engineering (IPCE 2010), 16th - 17th October 2010 organized by Centre for Graduate Studies, Universiti Malaysia Perlis (UniMAP) at School of Mechatronic Engineering, Pauh Putra Campus, Perlis, Malaysia.
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Universiti Malaysia Perlis (UniMAP)
2012
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my.unimap-214952012-10-21T08:11:27Z Analysis of optimum dispatching policies for semiconductor fabrication Mohd Azizi, Chik Uda, Hashim, Prof. Dr. Mohd_azizi@silterra.com First In First Out (FIFO) Shortest Processing Cycle Time (SPT) Critical Ratio (CR) Earliest Due Date (EDD) Shortest Remaining Processing Time (SPRT) Chemical mechanical polishing (CMP) Fabrication (FAB) Days Per Mask Layer (DPML) International Postgraduate Conference On Engineering (IPCE 2010), 16th - 17th October 2010 organized by Centre for Graduate Studies, Universiti Malaysia Perlis (UniMAP) at School of Mechatronic Engineering, Pauh Putra Campus, Perlis, Malaysia. This paper focuses on the comparison of the lot dispatching policies to reveal results for optimum product cycle time. The model is based on the 200mm-wafer size, 12K product Work In Progress (WIP), 10 product mixes in the current WIP with 2 new prototypes product start daily, and 3K-wafer start per week (WSPW) capacity. The dispatching policies to be compared are includes First In First Out (FIFO), Shortest Processing Time (SPT), Critical Ratio (CR), Earliest due date (EDD), Shortest Remaining Processing Time (SRPT) and Random (RAN). In the comparison, a snap shot of WIP of CMOS technology volume and product mix were taken at the wafer processing station from pad oxidation cleaning process to alloy. The result then is generated from the commercial simulation software, where requirements such as product processing time, manufacturing efficiency, equipment availability, WIP profile and product yield are the inputs for the model. The results reveal that CR dispatching policy gives the shortest cycle time for a product to complete all the processes of wafer fabrication steps compared to the other five dispatching policies by 5% to 13%. The results then enhanced and has been successfully accepted and realization in the real FAB operation. 2012-10-21T08:11:27Z 2012-10-21T08:11:27Z 2010-10-16 Working Paper 978-967-5760-03-7 http://hdl.handle.net/123456789/21495 en Proceedings of the International Postgraduate Conference on Engineering (IPCE 2010) Universiti Malaysia Perlis (UniMAP) Centre for Graduate Studies |
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First In First Out (FIFO) Shortest Processing Cycle Time (SPT) Critical Ratio (CR) Earliest Due Date (EDD) Shortest Remaining Processing Time (SPRT) Chemical mechanical polishing (CMP) Fabrication (FAB) Days Per Mask Layer (DPML) |
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First In First Out (FIFO) Shortest Processing Cycle Time (SPT) Critical Ratio (CR) Earliest Due Date (EDD) Shortest Remaining Processing Time (SPRT) Chemical mechanical polishing (CMP) Fabrication (FAB) Days Per Mask Layer (DPML) Mohd Azizi, Chik Uda, Hashim, Prof. Dr. Analysis of optimum dispatching policies for semiconductor fabrication |
description |
International Postgraduate Conference On Engineering (IPCE 2010), 16th - 17th October 2010 organized by Centre for Graduate Studies, Universiti Malaysia Perlis (UniMAP) at School of Mechatronic Engineering, Pauh Putra Campus, Perlis, Malaysia. |
author2 |
Mohd_azizi@silterra.com |
author_facet |
Mohd_azizi@silterra.com Mohd Azizi, Chik Uda, Hashim, Prof. Dr. |
format |
Working Paper |
author |
Mohd Azizi, Chik Uda, Hashim, Prof. Dr. |
author_sort |
Mohd Azizi, Chik |
title |
Analysis of optimum dispatching policies for semiconductor fabrication |
title_short |
Analysis of optimum dispatching policies for semiconductor fabrication |
title_full |
Analysis of optimum dispatching policies for semiconductor fabrication |
title_fullStr |
Analysis of optimum dispatching policies for semiconductor fabrication |
title_full_unstemmed |
Analysis of optimum dispatching policies for semiconductor fabrication |
title_sort |
analysis of optimum dispatching policies for semiconductor fabrication |
publisher |
Universiti Malaysia Perlis (UniMAP) |
publishDate |
2012 |
url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/21495 |
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1643793428344995840 |
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