Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices

• Main Authors: S., Makovejev, V., Kilchytska, Mohd Khairuddin, Md Arshad, D., Flandre, F., Andrieu, O., Faynot, S., Olsen, J. P., Raskin
• Format: Working Paper
• Language: English
• Published: Institute of Electrical and Electronics Engineers (IEEE) 2011
• Subjects: Bulk silicon; Ground planes; Interface effect; Output conductance; Self-heating; Substrate effects; Thermal properties; Ultra-thin; Ultrathin body
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/14887

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