Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
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Universiti Malaysia Perlis
2008
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my.unimap-13512008-07-01T03:59:31Z Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition Norahmad Barzrul Basaruddin Mohd Khairuddin Md Arshad (Advisor) AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials Access is limited to UniMAP community. The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up process steps prior completion of under bump metallurgy (UBM) deposition, aluminum bond pad activation, first zincation, zinc removal, second zincation, electroless nickel and immersion gold. Then the completed sample needs to be analyzed. To obtain the surface roughness and morphology of each deposition, the Atomic Force Microscopy (AFM) and Scanning Electron Microscope (SEM) were used. The first zincation process has high surface roughness but preserved surface morphology of initial thin film surface. The second zincation provides the improved surface roughness due to the replacement aluminum layer with ion zinc in the solution. 2008-07-01T03:59:31Z 2008-07-01T03:59:31Z 2007-03 Learning Object http://hdl.handle.net/123456789/1351 en Universiti Malaysia Perlis School of Microelectronic Engineering |
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Universiti Malaysia Perlis |
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UniMAP Library |
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Asia |
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Malaysia |
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Universiti Malaysia Perlis |
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UniMAP Library Digital Repository |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials |
| spellingShingle |
AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials Norahmad Barzrul Basaruddin Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| description |
Access is limited to UniMAP community. |
| author2 |
Mohd Khairuddin Md Arshad (Advisor) |
| author_facet |
Mohd Khairuddin Md Arshad (Advisor) Norahmad Barzrul Basaruddin |
| format |
Learning Object |
| author |
Norahmad Barzrul Basaruddin |
| author_sort |
Norahmad Barzrul Basaruddin |
| title |
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| title_short |
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| title_full |
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| title_fullStr |
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| title_full_unstemmed |
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition |
| title_sort |
characterization of electroless under bump metallurgy for alsi bond pad composition |
| publisher |
Universiti Malaysia Perlis |
| publishDate |
2008 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/1351 |
| _version_ |
1643787262902665216 |
| score |
13.222552 |