The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite

Organized by Universiti Malaysia Perlis (UniMAP), 9th - 12th June 2007 at Park Royal Hotel, Penang.

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Main Authors: Azlin Fazlina, Osman, Banjuraizah, Johar, Syed Nuzul Fadzli, Syed Adam, Sri Asliza, Md Amin, Amirro, Osman
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2008
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Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/1184
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spelling my.unimap-11842009-08-14T06:25:27Z The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite Azlin Fazlina, Osman Banjuraizah, Johar Syed Nuzul Fadzli, Syed Adam Sri Asliza, Md Amin Amirro, Osman Polypropylene Composites Polythylene Polymers -- Mechanical properties Silicon Silicon carbide Thermal conductivity Organized by Universiti Malaysia Perlis (UniMAP), 9th - 12th June 2007 at Park Royal Hotel, Penang. Silicon carbide filled Polypropylene (PP) composites are fabricated, where the compounding is carried out by using Z-blade mixer with filler loadings of 0wt%, 10wt%, 20wt% and 30wt%. Composite sheets produced from hot press molding process are prepared for testing samples. The effect of filler loadings and incorporation of coupling agent on density, porosity and thermal conductivity of SiC filled PP composites are studied. Thermal conductivity test is performed by using Digi Sense Scanning Thermometer apparatus. The results reported demonstrate that, the density and thermal conductivity of SiC filled PP composites increased with increasing filler loadings while the porosity decreased with increasing filler loadings. When treated with 5% titanate coupling agent (Lica-12), the increase of density for 10%SiC-90%PP and the increase of porosity for 30%SiC-90%PP composite can be observed. On the other hand, the increase of thermal conductivity can be observed for the composite treated with Lica-12 at 10% filler loading. However this treated SiC filled PP composites showed a decrease in thermal conductivity as filler loading increased. 2008-05-21T07:04:15Z 2008-05-21T07:04:15Z 2007-06-09 Working Paper http://hdl.handle.net/123456789/1184 en 1st International Conference on Sustainable Materials 2007 (ICoSM2007) Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Polypropylene
Composites
Polythylene
Polymers -- Mechanical properties
Silicon
Silicon carbide
Thermal conductivity
spellingShingle Polypropylene
Composites
Polythylene
Polymers -- Mechanical properties
Silicon
Silicon carbide
Thermal conductivity
Azlin Fazlina, Osman
Banjuraizah, Johar
Syed Nuzul Fadzli, Syed Adam
Sri Asliza, Md Amin
Amirro, Osman
The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
description Organized by Universiti Malaysia Perlis (UniMAP), 9th - 12th June 2007 at Park Royal Hotel, Penang.
format Working Paper
author Azlin Fazlina, Osman
Banjuraizah, Johar
Syed Nuzul Fadzli, Syed Adam
Sri Asliza, Md Amin
Amirro, Osman
author_facet Azlin Fazlina, Osman
Banjuraizah, Johar
Syed Nuzul Fadzli, Syed Adam
Sri Asliza, Md Amin
Amirro, Osman
author_sort Azlin Fazlina, Osman
title The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
title_short The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
title_full The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
title_fullStr The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
title_full_unstemmed The Effect of Porosity on Thermal Conductivity of Silicon Carbide Filled Polyproplyene Composite
title_sort effect of porosity on thermal conductivity of silicon carbide filled polyproplyene composite
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/1184
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score 13.222552