Cover Image

Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive

Link to publisher's homepage at http://www.taylorandfrancisgroup.com/

Saved in:
Bibliographic Details
Main Authors: Ho, Li Ngee, Tang, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi
Format: Article
Language:English
Published: Taylor & Francis 2010
Subjects:
Aging
Copper and alloy
Electrical properties
Phenolic
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/10178
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-10178
record_format dspace
spelling my.unimap-101782017-11-29T07:02:17Z Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive Ho, Li Ngee Tang, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi Aging Copper and alloy Electrical properties Phenolic Link to publisher's homepage at http://www.taylorandfrancisgroup.com/ In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA was investigated for long-term stability and reliability by aging at high temperature exposure at 125°C and 85°C/85% RH for 1000 h, respectively. Results showed that the electrical resistivity of the Cu-P-filled ECA could be maintained consistently low after high temperature exposure at 125°C for 1000 h or aging at 85°C/85% RH for 1000 h, compared with the rapidly increased resistivity of Cu-filled ECA over time. A significantly low final resistivity at an order of magnitude of 10-4 Ω·cm could be maintained in Cu-P-filled ECA even after aging at 85°C/85% RH for 1000 h. 2010-11-10T08:48:45Z 2010-11-10T08:48:45Z 2010-08 Article Journal of Adhesion, vol. 86(8), August 2010, pages 805-813 0021-8464 http://www.informaworld.com/smpp/content~db=all~content=a925212335~frm=titlelink http://hdl.handle.net/123456789/10178 en Taylor & Francis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Aging
Copper and alloy
Electrical properties
Phenolic
spellingShingle Aging
Copper and alloy
Electrical properties
Phenolic
Ho, Li Ngee
Tang, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
description Link to publisher's homepage at http://www.taylorandfrancisgroup.com/
format Article
author Ho, Li Ngee
Tang, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
author_facet Ho, Li Ngee
Tang, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
author_sort Ho, Li Ngee
title Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
title_short Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
title_full Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
title_fullStr Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
title_full_unstemmed Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
title_sort electrical properties of pre-alloyed cu-p containing electrically conductive adhesive
publisher Taylor & Francis
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/10178
_version_ 1643802683205746688
score 13.214268

Similar Items