Thermal performance improvement of microchannel heat sink for electronic device cooling system using numerical analysis

• Main Authors: Muhammad Aidil Safwan, Abdul Aziz, Nofrizalidris, Darlis, Izuan Amin, Ishak, Nor Atiqah, Zolpakar, Mohammad Arafat, ., Muhammadu, Masin Muhammadu
• Format: Article
• Language: English
• Published: Semarak Ilmu Publishing 2024
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://umpir.ump.edu.my/id/eprint/44070/1/Thermal%20performance%20improvement%20of%20microchannel%20heat%20sink.pdf; http://umpir.ump.edu.my/id/eprint/44070/; https://doi.org/10.37934/arnht.26.1.8498; https://doi.org/10.37934/arnht.26.1.8498

The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like integrated circuits and personal computer. In order to guarantee the safety and extended operation of these devices, the thermal performance...