Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting poi...

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Main Authors: Bashir, M. Nasir, Saad, Hafiz Muhammad, Muhammad, Rizwan, Quazi, Moinuddin Mohammed, Ali, Muhammad Mahmood, Ahmed, Arslan E.M., Zaidi, Asad Ali, Soudagar, Manzoore Elahi M., Haseeb, Abdul S.Md Abdul, Naher, Sumsun
Format: Article
Language:English
English
Published: Springer 2022
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Online Access:http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf
http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf
http://umpir.ump.edu.my/id/eprint/40187/
https://doi.org/10.1007/s10854-022-09028-5
https://doi.org/10.1007/s10854-022-09028-5
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spelling my.ump.umpir.401872024-02-08T04:40:00Z http://umpir.ump.edu.my/id/eprint/40187/ Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint Bashir, M. Nasir Saad, Hafiz Muhammad Muhammad, Rizwan Quazi, Moinuddin Mohammed Ali, Muhammad Mahmood Ahmed, Arslan E.M. Zaidi, Asad Ali Soudagar, Manzoore Elahi M. Haseeb, Abdul S.Md Abdul Naher, Sumsun T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times. Springer 2022-10 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf pdf en http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf Bashir, M. Nasir and Saad, Hafiz Muhammad and Muhammad, Rizwan and Quazi, Moinuddin Mohammed and Ali, Muhammad Mahmood and Ahmed, Arslan E.M. and Zaidi, Asad Ali and Soudagar, Manzoore Elahi M. and Haseeb, Abdul S.Md Abdul and Naher, Sumsun (2022) Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint. Journal of Materials Science: Materials in Electronics, 33 (28). pp. 22499-22507. ISSN 0957-4522. (Published) https://doi.org/10.1007/s10854-022-09028-5 https://doi.org/10.1007/s10854-022-09028-5
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
TJ Mechanical engineering and machinery
TL Motor vehicles. Aeronautics. Astronautics
Bashir, M. Nasir
Saad, Hafiz Muhammad
Muhammad, Rizwan
Quazi, Moinuddin Mohammed
Ali, Muhammad Mahmood
Ahmed, Arslan E.M.
Zaidi, Asad Ali
Soudagar, Manzoore Elahi M.
Haseeb, Abdul S.Md Abdul
Naher, Sumsun
Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
description Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.
format Article
author Bashir, M. Nasir
Saad, Hafiz Muhammad
Muhammad, Rizwan
Quazi, Moinuddin Mohammed
Ali, Muhammad Mahmood
Ahmed, Arslan E.M.
Zaidi, Asad Ali
Soudagar, Manzoore Elahi M.
Haseeb, Abdul S.Md Abdul
Naher, Sumsun
author_facet Bashir, M. Nasir
Saad, Hafiz Muhammad
Muhammad, Rizwan
Quazi, Moinuddin Mohammed
Ali, Muhammad Mahmood
Ahmed, Arslan E.M.
Zaidi, Asad Ali
Soudagar, Manzoore Elahi M.
Haseeb, Abdul S.Md Abdul
Naher, Sumsun
author_sort Bashir, M. Nasir
title Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
title_short Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
title_full Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
title_fullStr Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
title_full_unstemmed Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
title_sort effects of tin particles addition on structural and mechanical properties of eutectic sn–58bi solder joint
publisher Springer
publishDate 2022
url http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf
http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf
http://umpir.ump.edu.my/id/eprint/40187/
https://doi.org/10.1007/s10854-022-09028-5
https://doi.org/10.1007/s10854-022-09028-5
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