A simulation study on interfacial reaction between Sn3Ag0.5Cu and Sn0.7Cu using different substrates after reflow soldering

• Main Authors: M. H., Mohd Zaki, S. R. A., Idris
• Format: Conference or Workshop Item
• Language: English; English
• Published: Springer 2023
• Subjects: T Technology (General); TJ Mechanical engineering and machinery
• Online Access: http://umpir.ump.edu.my/id/eprint/39416/1/A%20simulation%20study%20on%20interfacial%20reaction%20between%20Sn3Ag0.5Cu.pdf; http://umpir.ump.edu.my/id/eprint/39416/2/A%20simulation%20study%20on%20interfacial%20reaction%20between%20Sn3Ag0.5Cu_FULL.pdf; http://umpir.ump.edu.my/id/eprint/39416/; https://doi.org/10.1007/978-981-19-1457-7_62

Reflow soldering is a process to create joining between the board and electronic component in order to make sure the electronic devices may function well. The aim of this study is to determine the solder joint strength through simulations using data from previous researchers. Two type of solder allo...