Investigation of optimum EDM die sinking parameters in micro dimple machining

• Main Authors: Lee, Jie Ying, Ahmad Rosli, Abdul Manaf
• Format: Article
• Language: English
• Published: Penerbit UMP 2022
• Subjects: TJ Mechanical engineering and machinery; TS Manufactures
• Online Access: http://umpir.ump.edu.my/id/eprint/34129/1/Investigation%20of%20optimum%20EDM%20die%20sinking%20parameters.pdf; http://umpir.ump.edu.my/id/eprint/34129/; https://doi.org/10.15282/jmmst.v6i1.7485; https://doi.org/10.15282/jmmst.v6i1.7485

Micro dimple is a standard surface structure that is commonly used in micro-moulds, micro/nano-fluid devices, micromechanical systems, and bionic functional surfaces. These microstructure surfaces can be used for optical communication systems, micro sensors, flat panel display, light emitting diode...