Effect of Immersion Coating Deposition Time on Solder Joint Properties
Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion...
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Trans Tech Publications, Switzerland
2016
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Online Access: | http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf http://umpir.ump.edu.my/id/eprint/11693/ http://www.scientific.net/AMR.1133.361 |
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my.ump.umpir.116932018-01-15T08:27:55Z http://umpir.ump.edu.my/id/eprint/11693/ Effect of Immersion Coating Deposition Time on Solder Joint Properties Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively. Trans Tech Publications, Switzerland 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar and Siti Rabiatull Aisha, Idris and M., Ishak (2016) Effect of Immersion Coating Deposition Time on Solder Joint Properties. Advanced Materials Research, 1133. pp. 361-365. ISSN 1022-6680 (print), 1662-8985 (online) http://www.scientific.net/AMR.1133.361 DOI: 10.4028/www.scientific.net/AMR.1133.361 |
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TJ Mechanical engineering and machinery Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak Effect of Immersion Coating Deposition Time on Solder Joint Properties |
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Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively. |
format |
Article |
author |
Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak |
author_facet |
Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak |
author_sort |
Zetty Akhtar, Abd Malek |
title |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
title_short |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
title_full |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
title_fullStr |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
title_full_unstemmed |
Effect of Immersion Coating Deposition Time on Solder Joint Properties |
title_sort |
effect of immersion coating deposition time on solder joint properties |
publisher |
Trans Tech Publications, Switzerland |
publishDate |
2016 |
url |
http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf http://umpir.ump.edu.my/id/eprint/11693/ http://www.scientific.net/AMR.1133.361 |
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13.18916 |