Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four...

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Bibliographic Details
Main Authors: Mazlan Mohamed, Muhamad Iqbal Ahmad, A.M. Mustafa Al Bakri, Huck-Soo Loo, M.S. Abdul Aziz, Abdullah. N.R
Format: Non-Indexed Article
Published: 2013
Online Access:http://discol.umk.edu.my/id/eprint/7859/
http://www.ajbasweb.com/ajbas/2013/Special,%20issue2%202013/220-229.pdf
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