Effect of iron and bismuth addition on the microstructure and mechanical properties of sac105 solder under severe thermal environment / Bakhtiar Ali
The transition to lead-free soldering for the electronic industry has been necessitated by the health and environmental concerns over the usage of lead and lead-containing products. Many lead-free solders have been extensively researched for this purpose. Amongst all, the near-eutectic Sn-3.0Ag-0.5C...
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| Format: | Thesis |
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2017
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| Online Access: | http://studentsrepo.um.edu.my/8034/7/bakhtiar.pdf http://studentsrepo.um.edu.my/8034/ |
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