Performance of Ni-W alloys as barrier film between lead free solder and copper substrate / Chew Chee Sean
Due to environmental concerns, the electronics industry is actively shifting from lead solders to lead free solders. Sn based lead free solders are the most suitable 49is used in the under bump metallurgy (UBM) and substrate metallization for flip chip and ball grid array (BGA) applications. Inte...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2011
|
| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/8014/1/KGA080081.pdf http://studentsrepo.um.edu.my/8014/7/KGA080081.pdf http://studentsrepo.um.edu.my/8014/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|