Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding

• المؤلف الرئيسي: Zhou , Ding
• التنسيق: أطروحة
• منشور في: 2024
• الموضوعات: TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://studentsrepo.um.edu.my/15495/2/Zhou_Ding.pdf; http://studentsrepo.um.edu.my/15495/1/Zhou_Ding.pdf; http://studentsrepo.um.edu.my/15495/

Sn-Ag-Cu (SAC) alloys have been identified as promising replacements for standard 63Sn-37Pb eutectic solder after the restriction in legislation of lead (Pb) in electronics has been actively pursued. However, the reliability of Pb-free solders, used in harsh conditions such as in automotive, is stil...