Microstructural characteristics and mechanical performance of Bi-Sb-Ni added Sn 3.0Ag-0.5Cu multicomponent lead-free solder alloy / Zhou Ding
Sn-Ag-Cu (SAC) alloys have been identified as promising replacements for standard 63Sn-37Pb eutectic solder after the restriction in legislation of lead (Pb) in electronics has been actively pursued. However, the reliability of Pb-free solders, used in harsh conditions such as in automotive, is stil...
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| Format: | Thesis |
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2024
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| Online Access: | http://studentsrepo.um.edu.my/15495/2/Zhou_Ding.pdf http://studentsrepo.um.edu.my/15495/1/Zhou_Ding.pdf http://studentsrepo.um.edu.my/15495/ |
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