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The effects of adding silver and indium to lead-free solders

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Main Authors: Dharma, I.G.B., Abd Shukor, Mohd Hamdi, Ariga, T.
Format: Article
Published: 2009
Subjects:
TS Manufactures
Online Access:http://eprints.um.edu.my/6973/
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id my.um.eprints.6973
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spelling my.um.eprints.69732021-10-01T03:58:23Z http://eprints.um.edu.my/6973/ The effects of adding silver and indium to lead-free solders Dharma, I.G.B. Abd Shukor, Mohd Hamdi Ariga, T. TS Manufactures 2009 Article PeerReviewed Dharma, I.G.B. and Abd Shukor, Mohd Hamdi and Ariga, T. (2009) The effects of adding silver and indium to lead-free solders. Welding Journal, 88 (4). pp. 45-48. ISSN 0043-2296
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TS Manufactures
spellingShingle TS Manufactures
Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
The effects of adding silver and indium to lead-free solders
format Article
author Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
author_facet Dharma, I.G.B.
Abd Shukor, Mohd Hamdi
Ariga, T.
author_sort Dharma, I.G.B.
title The effects of adding silver and indium to lead-free solders
title_short The effects of adding silver and indium to lead-free solders
title_full The effects of adding silver and indium to lead-free solders
title_fullStr The effects of adding silver and indium to lead-free solders
title_full_unstemmed The effects of adding silver and indium to lead-free solders
title_sort effects of adding silver and indium to lead-free solders
publishDate 2009
url http://eprints.um.edu.my/6973/
_version_ 1713200134323437568
score 13.18916

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