Anodisation of copper in thiourea-containing acid solution - part II. in situ transversal imaging observations. kinetics of anodic film growth

• Main Authors: Haseeb, A.S. Md. Abdul, Schilardi, P.L., Bolzan, A.E., Piatti, R.C.V., Salvarezza, R.C., Arvia, A.J.
• Format: Article
• Published: Elsevier 2001
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.um.edu.my/5780/; https://doi.org/10.1016/S0022-0728(00)00216-3

The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E < 0.07 V (vs. SCE) the...