Pressure sintering of micro-silver joints in SiC power devices: Optimization of processing parameters and FEM analysis
The sintering process of micro-silver joints in SiC devices that operate in high temperatures has attracted considerable attention in recent years, owing to its advantages in low processing temperatures. The first part of this work carries out a thorough investigation into the effects of the process...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
Springer
2024
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/44793/ |
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