Leverage of environmental pollutant crump rubber on the dry sliding wear response of epoxy composites

• Main Authors: Shahapurkar, Kiran, Chenrayan, Venkatesh, Soudagar, Manzoore Elahi M., Badruddin, Irfan Anjum, Shahapurkar, Pavan, Elfasakhany, Ashraf, Mujtaba, Muhammad Abbas, Siddiqui, Md Irfanul Haque, Ali, Masood Ashraf, Mahlia, Teuku Meurah Indra
• Format: Article
• Published: MDPI 2021
• Subjects: GE Environmental Sciences; QC Physics; QD Chemistry
• Online Access: http://eprints.um.edu.my/34387/

The effect of crump rubber on the dry sliding wear behavior of epoxy composites is investigated in the present study. Wear tests are carried out for three levels of crump rubber (10, 20, and 30 vol.%), normal applied load (30, 40, and 50 N), and sliding distance (1, 3, and 5 km). The wear behavior of crump rubber-epoxy composites is investigated against EN31 steel discs. The hybrid mathematical approach of Taguchi-coupled Grey Relational Analysis (GRA)-Principal Component Analysis (PCA) is used to examine the influence of crump rubber on the tribological response of composites. Mathematical and experimental results reveal that increasing crump rubber content reduces the wear rate of composites. Composites also show a significant decrease in specific wear values at higher applied loads. Furthermore, the coefficient of friction also shows a decreasing trend with an increase in crump rubber content, indicating the effectiveness of reinforcing crump rubber in a widely used epoxy matrix. Analysis of Variance (ANOVA) results also reveal that the crump rubber content in the composite is a significant parameter to influence the wear characteristic. The post-test temperature of discs increases with an increase in the applied load, while decreasing with an increase in filler loading. Worn surfaces are analyzed using scanning electron microscopy to understand structure-property correlations. Finally, existing studies available in the literature are compared with the wear data of the present study in the form of a property map.