A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG

A novel half-bonded chirped fiber Bragg grating on a natural rubber diaphragm has been proposed to enhance the sensitivity and to compensate the temperature effects of a hydrostatic liquid-level sensor. This innovative fabrication method is resulted in the narrowing of the bandwidth with the hydrost...

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Main Authors: Vorathin, E., Hafizi, Z.M., Aizzuddin, A.M., Zaini, Muhammad Khairol Annuar, Lim, Kok Sing
Format: Article
Published: Institute of Electrical and Electronics Engineers (IEEE) 2019
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Online Access:http://eprints.um.edu.my/19961/
https://doi.org/10.1109/JSEN.2018.2875532
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spelling my.um.eprints.199612019-01-11T08:36:07Z http://eprints.um.edu.my/19961/ A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG Vorathin, E. Hafizi, Z.M. Aizzuddin, A.M. Zaini, Muhammad Khairol Annuar Lim, Kok Sing Q Science (General) QC Physics TJ Mechanical engineering and machinery A novel half-bonded chirped fiber Bragg grating on a natural rubber diaphragm has been proposed to enhance the sensitivity and to compensate the temperature effects of a hydrostatic liquid-level sensor. This innovative fabrication method is resulted in the narrowing of the bandwidth with the hydrostatic pressure sensitivity recorded at-253 pm/kPa and water column sensitivity at-0.0253 nm/cm. The bandwidth modulation measurement was insensitive to temperature variations when compared with center wavelength modulation measurement. Furthermore, the proposed hydrostatic liquid-level sensor is compatible with a low-cost photodetector. Institute of Electrical and Electronics Engineers (IEEE) 2019 Article PeerReviewed Vorathin, E. and Hafizi, Z.M. and Aizzuddin, A.M. and Zaini, Muhammad Khairol Annuar and Lim, Kok Sing (2019) A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG. IEEE Sensors Journal, 19 (1). pp. 157-162. ISSN 1530-437X https://doi.org/10.1109/JSEN.2018.2875532 doi:10.1109/JSEN.2018.2875532
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic Q Science (General)
QC Physics
TJ Mechanical engineering and machinery
spellingShingle Q Science (General)
QC Physics
TJ Mechanical engineering and machinery
Vorathin, E.
Hafizi, Z.M.
Aizzuddin, A.M.
Zaini, Muhammad Khairol Annuar
Lim, Kok Sing
A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
description A novel half-bonded chirped fiber Bragg grating on a natural rubber diaphragm has been proposed to enhance the sensitivity and to compensate the temperature effects of a hydrostatic liquid-level sensor. This innovative fabrication method is resulted in the narrowing of the bandwidth with the hydrostatic pressure sensitivity recorded at-253 pm/kPa and water column sensitivity at-0.0253 nm/cm. The bandwidth modulation measurement was insensitive to temperature variations when compared with center wavelength modulation measurement. Furthermore, the proposed hydrostatic liquid-level sensor is compatible with a low-cost photodetector.
format Article
author Vorathin, E.
Hafizi, Z.M.
Aizzuddin, A.M.
Zaini, Muhammad Khairol Annuar
Lim, Kok Sing
author_facet Vorathin, E.
Hafizi, Z.M.
Aizzuddin, A.M.
Zaini, Muhammad Khairol Annuar
Lim, Kok Sing
author_sort Vorathin, E.
title A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
title_short A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
title_full A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
title_fullStr A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
title_full_unstemmed A Novel Temperature-Insensitive Hydrostatic Liquid-Level Sensor Using Chirped FBG
title_sort novel temperature-insensitive hydrostatic liquid-level sensor using chirped fbg
publisher Institute of Electrical and Electronics Engineers (IEEE)
publishDate 2019
url http://eprints.um.edu.my/19961/
https://doi.org/10.1109/JSEN.2018.2875532
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score 13.18916