Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints

• Main Authors: Tan, A.T., Tan, A.W., Yusof, F.
• Format: Article
• Published: Elsevier 2016
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/17717/; http://dx.doi.org/10.1016/j.jmatprotec.2016.06.036

Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investi...