Effect of addition cobalt nanoparticles on Sn-Ag-Cu lead-free solder
Nowadays, nanoelectroctronic, electro-nanotechnologies environmental friendly products become the roadmap in industry. Hence, nanoscale of reinforcement into lead-free solder becomes more popular rather than the micro size of reinforcement. In this paper, Cobalt nanoparticles-reinforced Sn-Ag-Cu...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/12918/1/E1.4-P0283.pdf http://eprints.um.edu.my/12918/ |
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