Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan

Heat pipe is a two-phase heat transfer devices with extremely high effective thermal conductivity. They can be cylindrical or planar in structure. Heat pipes can be embedded in a metal cooling plate, which is attached to the heat source, and can also be assembled with fin stack for fluid heal transf...

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Main Author: Narayanan, Ramadas
Format: Conference or Workshop Item
Language:English
Published: 2006
Subjects:
Online Access:https://ir.uitm.edu.my/id/eprint/81722/1/81722.PDF
https://ir.uitm.edu.my/id/eprint/81722/
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spelling my.uitm.ir.817222023-08-15T05:16:22Z https://ir.uitm.edu.my/id/eprint/81722/ Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan Narayanan, Ramadas Transfer functions Electronics Heat pipe is a two-phase heat transfer devices with extremely high effective thermal conductivity. They can be cylindrical or planar in structure. Heat pipes can be embedded in a metal cooling plate, which is attached to the heat source, and can also be assembled with fin stack for fluid heal transfer. Due to the high heat transport capacity, heat exchangers with heat pipes have become much smaller than traditional heat exchangers in handling high heat fluxes. With the working fluid in a heat pipe, heat can be absorbed on the evaporator region and transported to the condenser region where the vapor condenses releasing the heat to the cooling media. Heat pipe technology has found its increasing applications in Electronic Cooling and enhancing the thermal performance of Heat Recovery Systems in industrial sectors. 2006 Conference or Workshop Item PeerReviewed text en https://ir.uitm.edu.my/id/eprint/81722/1/81722.PDF Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan. (2006) In: Volume No. 1: Science and Technology, 30 – 31 May 2006, Swiss Garden Resort & Spa Kuantan, Pahang.
institution Universiti Teknologi Mara
building Tun Abdul Razak Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Mara
content_source UiTM Institutional Repository
url_provider http://ir.uitm.edu.my/
language English
topic Transfer functions
Electronics
spellingShingle Transfer functions
Electronics
Narayanan, Ramadas
Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
description Heat pipe is a two-phase heat transfer devices with extremely high effective thermal conductivity. They can be cylindrical or planar in structure. Heat pipes can be embedded in a metal cooling plate, which is attached to the heat source, and can also be assembled with fin stack for fluid heal transfer. Due to the high heat transport capacity, heat exchangers with heat pipes have become much smaller than traditional heat exchangers in handling high heat fluxes. With the working fluid in a heat pipe, heat can be absorbed on the evaporator region and transported to the condenser region where the vapor condenses releasing the heat to the cooling media. Heat pipe technology has found its increasing applications in Electronic Cooling and enhancing the thermal performance of Heat Recovery Systems in industrial sectors.
format Conference or Workshop Item
author Narayanan, Ramadas
author_facet Narayanan, Ramadas
author_sort Narayanan, Ramadas
title Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
title_short Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
title_full Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
title_fullStr Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
title_full_unstemmed Heat pipe technology for electronic cooling and heat recovery systems / Ramadas Narayanan
title_sort heat pipe technology for electronic cooling and heat recovery systems / ramadas narayanan
publishDate 2006
url https://ir.uitm.edu.my/id/eprint/81722/1/81722.PDF
https://ir.uitm.edu.my/id/eprint/81722/
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score 13.149126