Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]

• Main Authors: Singh, Amares, Durairaj, Rajkumar, Lee, Kong Chian, Sia, Yaw Yoong
• Format: Article
• Language: English
• Published: Faculty of Mechanical Engineering Universiti Teknologi MARA (UiTM) 2018
• Subjects: Engineering machinery, tools, and implements; TJ Mechanical engineering and machinery
• Online Access: http://ir.uitm.edu.my/id/eprint/39387/1/39387.pdf; http://ir.uitm.edu.my/id/eprint/39387/

Solder alloys are vital in any electronic packaging industry especially in terms of its connectivity with the substrate. Mechanical properties are usually associated to prove and test the reliability of the solder and substrate. Ultimately, the customary Sn-Pb solders are known to be the ideal solde...