Development of zinc based alloy for solderability
Zinc based alloy is being proposed as an alternative material in metal based giftware industry. Most of the giftware is handmade using simple process such as casting, polishing and soldering. Soldering of commercial zinc alloy is difficult due to poor bonding between solder material and base meta...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/8003/1/icmme2011_submission_62.pdf http://irep.iium.edu.my/8003/ |
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| Summary: | Zinc based alloy is being proposed as an alternative material in metal based giftware industry.
Most of the giftware is handmade using simple process such as casting, polishing and
soldering. Soldering of commercial zinc alloy is difficult due to poor bonding between solder
material and base metal. Therefore, development of casting material is necessary to improve
the solder properties. This work investigates the effect of aluminum and tin additions on the
solder properties of zinc based alloy. Solder properties were studied based on the spread area
and adhesion of molten solder alloy when it contacts the base metal. Experimental work was
carried out by putting the base metal on an electrically heated aluminum block with the
temperature set at 265°C. Solder alloy was first dipped in the flux solution and then
transferred to the top of the base metal. The spread area values of the solidified solder alloy
on the base metal were then estimated.
Furthermore, scanning electron microscope (SEM) microstructure study and energy
dispersive X-ray spectroscopy (EDX) elemental analysis were conducted. The results showed
that tin addition has significant effect on the spread area compared to aluminum. Similarly,
adhesions between base metal and solder alloy were positive for zinc alloyed with tin unlike
zinc alloyed with aluminum. |
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