Micro wire electro discharge grinding: optimization of material removal rate and surface roughness
This paper presents the analysis and modelling of material removal rate (MRR) and surface roughness (Ra) by micro wire electro discharge grinding (micro-WEDG) with control parameter of gap voltage, feed rate, and spindle speed. The data were analyzed and empirical models are developed. The optimized...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English English |
| Published: |
Institute of Physics Publishing
2017
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/56335/1/56335_Micro%20Wire%20Electro_complete.pdf http://irep.iium.edu.my/56335/2/56335_Micro%20Wire%20Electro_SCOPUS.pdf http://irep.iium.edu.my/56335/ http://iopscience.iop.org/article/10.1088/1757-899X/184/1/012032 |
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| Summary: | This paper presents the analysis and modelling of material removal rate (MRR) and surface roughness (Ra) by micro wire electro discharge grinding (micro-WEDG) with control parameter of gap voltage, feed rate, and spindle speed. The data were analyzed and empirical models are developed. The optimized values of MRR and Ra are 0.051 mm3/min and 0.25 μm respectively with 110 V gap voltage, 38 μm/s feed rate, and 1315 rpm spindle speed. The analysis showed that gap voltage has significant effect on material removal rate while spindle speed has significant effect on surface roughness. |
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