Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Per...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39051/1/IEMT_2012.pdf http://irep.iium.edu.my/39051/ http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6521786 |
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