COOLING/HEATING A CONFINED SPACE USING PELTIER EFFECT DEVICE
The objective of this project is to design a confined space which can heat or cool the items as required. The mechanism used for cooling and heating is the Peltier Effect Device whereby a normal refrigerant (e.g. gases or water) as the thermal media is not used in the design. Peltier effect devic...
Saved in:
Main Author: | |
---|---|
Format: | Final Year Project |
Language: | English |
Published: |
Universiti Teknologi PETRONAS
2006
|
Subjects: | |
Online Access: | http://utpedia.utp.edu.my/9302/1/2006%20-%20COOLINGHEATING%20A%20CONFINED%20SPACE%20USING%20PELTIER%20EFFECT%20DEVICE.pdf http://utpedia.utp.edu.my/9302/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | The objective of this project is to design a confined space which can heat or cool the
items as required. The mechanism used for cooling and heating is the Peltier Effect
Device whereby a normal refrigerant (e.g. gases or water) as the thermal media is not
used in the design. Peltier effect device are made of an N and P type semiconductors that
are joined together by metal contact to form a junction that can perform cooling on one
side while heating on the other side. The literature review aids better understanding of
the project title. Analysis stage helps in problem solving thus decision making process.
Tools identification is essential to determine the equipments and software needed in this
project. The project is developed using a set of defined procedures and is illustrated more
vivid in a logic flowchart. H-Bridge circuit analysis has been carried out with the
calculated values of resistors in order to obtain the fmal working circuit. The temperature
controller will consists of temperature sensor which is LM35 and microcontroller PIC
16F877. The coding of the PIC program has been finalize and progranuned. Heat transfer
calculation has also been calculated. The container that will be used for the prototype is
400ml thermos with double wall for temperature retention. The Peltier is attached at the
lid of the container where a hole has been made. The temperature sensor is placed near
the Peltier. Between the Peltier and the heat sink, thermal paste is applied evenly to help
removing the heat faster. Then, a 12V fan is glued on top of the heat sink. This prototype
can cool down to 1 ooc for cooling and go up to 60°C for heating. |
---|