Comparison of Microstructure and Hardness of Sintered Carbon Fiber and Carbon Nanotubes Reinforced Copper Matrix

Rapid growth of advance electronics device in electronics industry has its limitation in overheating problem. The solution for this limitation is by introducing the heat sinking material which has excellent properties such as higher thermal conductivity, hardness and strength. This report presents r...

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Bibliographic Details
Main Author: Noraini Binti Esa, Noraini
Format: Final Year Project
Language:English
Published: Universiti Teknologi Petronas 2009
Subjects:
Online Access:http://utpedia.utp.edu.my/719/1/NORAINI_BINTI_ESA-REPORT.pdf
http://utpedia.utp.edu.my/719/
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