MODELING INTERGRANULAR FRACTURE AT ELEVATED TEMPERATURE

• Main Author: Ahmad Kamil, Muhammad Akmalhazwan
• Format: Final Year Project
• Language: English
• Published: UNIVERSITI TEKNOLOGI PETRONAS 2012
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://utpedia.utp.edu.my/6254/1/Dissertation-Modeling%20Intergranular%20Fracture%20at%20Elevated%20Temperature.pdf; http://utpedia.utp.edu.my/6254/

This project aimed to produce numerical models for intergranular fracture at elevated temperature as continuation of the work by Rishi Raj and M.F. Ashby [1]. They have been studying about intergranular fracture caused by void formation mainly on homogenous copper. As one of the most referred journal in intergranular fracture at elevated temperature, working numerical models on other materials have not yet been made available. Upon completion of the numerical model, it will be then applied to other materials and applications that are exposed to intergranular fracture at elevated temperature. This project is divided in two main sections; to build a numerical model for nucleation of voids and the growth of voids. Even though there are many types of creep failures, the project will be centered only on creep failure as a result of nucleation, growth and coalescence of voids. The work will reproduce the model of nucleation and growth based on copper data as in the work of Raj and Ashby [1] and then to apply the models to other materials. It is anticipated that with the nucleation and growth models, estimation of rupture time of a material at elevated temperature can be reliably predicted. It is important not to confuse between intergranular fracture caused by void nucleation, growth and coalescence and intergranular fracture caused by boundary cracking. Major difference between these two is intergranular fracture caused by void formation occur in low stress, elevated temperature environment whereas intergranular fracture caused by boundary cracking is due to high stress exerted to the material.