The Effect Of Pre-Tinning Process With Respect To Gold Embrittlement Issue For Gold Plated Pins
This project is a study of interaction between tin-lead solder with gold that associated with intermetallic compound IMC. Alloy Sn63Pb37 solder is used as a control for the experiment. Effect of IMC formation to joint reliability is studied by varying the gold thickness through pre-tinning process....
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Format: | Final Year Project |
Language: | English |
Published: |
Universiti Teknologi Petronas
2010
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Subjects: | |
Online Access: | http://utpedia.utp.edu.my/1488/1/Mohammad_Noor_Bin_Md_Yassin.pdf http://utpedia.utp.edu.my/1488/ |
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Summary: | This project is a study of interaction between tin-lead solder with gold that associated with intermetallic compound IMC. Alloy Sn63Pb37 solder is used as a control for the experiment. Effect of IMC formation to joint reliability is studied by varying the gold thickness through pre-tinning process. A rough guide of implementation to prevent gold embrittlement to Sn63Pb37 solder is given at the end of the research. Physical analysis equipment X-ray fluorescence (XRF) and high power optical scope for IMC microstructure investigation are utilized. It is found out in this study that the time of pre-tinning process where the pins are submerge into solder bath contribute to the magnitude of IMC formation. |
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