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Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications

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Bibliographic Details
Main Author: Liew, Jian Ping
Format: Final Year Project / Dissertation / Thesis
Published: 2016
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf
http://eprints.utar.edu.my/2189/
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spelling my-utar-eprints.21892017-08-14T03:04:44Z Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications Liew, Jian Ping TJ Mechanical engineering and machinery 2016 Final Year Project / Dissertation / Thesis NonPeerReviewed application/pdf http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf Liew, Jian Ping (2016) Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications. Master dissertation/thesis, UTAR. http://eprints.utar.edu.my/2189/
institution Universiti Tunku Abdul Rahman
building UTAR Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tunku Abdul Rahman
content_source UTAR Institutional Repository
url_provider http://eprints.utar.edu.my
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Liew, Jian Ping
Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
format Final Year Project / Dissertation / Thesis
author Liew, Jian Ping
author_facet Liew, Jian Ping
author_sort Liew, Jian Ping
title Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
title_short Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
title_full Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
title_fullStr Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
title_full_unstemmed Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications
title_sort rheological studies of silver nanoparticles based isotropic conductive adhesive (ag-icas) for microelectronic packaging applications
publishDate 2016
url http://eprints.utar.edu.my/2189/1/ESA%2D2016%2D1106774%2D1.pdf
http://eprints.utar.edu.my/2189/
_version_ 1646030863064891392
score 13.18916

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