Copper nanoparticles coating on FTO with improved adhesion using direct and pulse electrodeposition techniques from a simple copper sulphate solution

• Main Authors: Nur Azlina Adris,, Lorna Jeffery Minggu,, Khuzaimah Arifin,, Rozan Mohamad Yunus,, Mohamad Azuwa Mohamed,, Masliana Muslimin,, Mohammad Kassim,
• Format: Article
• Language: English
• Published: Penerbit Universiti Kebangsaan Malaysia 2023
• Online Access: http://journalarticle.ukm.my/22886/1/SML%204.pdf; http://journalarticle.ukm.my/22886/; https://www.ukm.my/jsm/english_journals/vol52num8_2023/contentsVol52num8_2023.html

Copper (Cu) metal nanoparticles were deposited onto FTO glass using the electrodeposition method. The precursor used was CuSO4 ⋅5H2 O with Na2 SO4 as the inorganic additive. The formation of Cu was characterized using field emission scanning electron microscopy (FESEM), energy-dispersive X-ray spect...