Determination of thermal expansion coefficient for ball grid array using digital image correlation
This paper presents the analysis of coefficient of thermal expansion (CTE) of solder ball on a ball grid array (BGA) through digital image correlation (DIC) technique. The assessment of thermal mechanical properties of semiconductor component is a main challenge due to the sensitivity of micro-scale...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2022
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| Online Access: | http://journalarticle.ukm.my/20039/1/06.pdf http://journalarticle.ukm.my/20039/ https://www.ukm.my/jkukm/volume-3403-2022/ |
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