Eliminating adhesive layers in silver metallization: A comparative study of glass cleaning methods for enhanced hydroxylation and adhesion
Achieving robust adhesion and cost-efficiency in silver (Ag) thin films is pivotal for advancing microelectronic applications, owing to Ag’s exceptional low resistivity and thermal stability. This study investigates an optimized approach to hydroxylate glass substrates, effectively eliminating the r...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | en |
| Published: |
elsevier
2025
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/12704/1/J19532_17b2671c66eb1d12379da68fa430ea67.pdf http://eprints.uthm.edu.my/12704/ https://doi.org/10.1016/j.cap.2025.01.002 |
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