Microstructural studies of Cu-Al Intermetallic Compound at Thermosonic Wire Bonding Interface

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad bonding interface has been an area of interest for researchers. In this paper, characterization of IMC at bonding interface of annealed diode micro-chip has been performed using Scanning Electron Microscope (SEM), Transmission Electron Micros...

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Bibliographic Details

Main Authors:	Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Abd Rashid, Mohd Warikh, Hng, May Ting, Lee, Cher Chia
Format:	Conference or Workshop Item
Language:	en
Published:	2012
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/6959/1/idecon2012_Anand_105.pdf http://eprints.utem.edu.my/id/eprint/6959/ http://idecon.utem.edu.my/
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