Transient thermal simulation analysis of die-attach adhesives

This paper discusses the approach of using a three-dimensional finite element analysis (FEA) model for transient thermal analysis of die-attach materials layers with the silicon carbide (SiC) diodes directly attached to the bonded copper. For FEA analysis, six different die-attach materials models w...

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Bibliographic Details

Main Authors:	Salim, Mohd Azli, Ab Wahid, Ameeruz Kamal, Masripan, Nor Azmmi, Photong, Chonlatee, Md. Saad, Adzni, Akop, Mohd Zaid
Format:	Article
Language:	en
Published:	Universiti Malaysia Perlis 2022
Online Access:	http://eprints.utem.edu.my/id/eprint/26667/2/PAPER%20PUBLISHED%20ID%2038.PDF http://eprints.utem.edu.my/id/eprint/26667/ https://ijneam.unimap.edu.my/images/PDF/ISSTE2022/Vol_15_SI_March_2022_505-522.pdf
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