Properties Of Epoxy/Silica Thin Film Composite For Electronic Application.

In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.

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Bibliographic Details
Main Authors:	M, Mariatti, Foo,, Y.L., A, Azizan, Sim, L.C.
Format:	Conference or Workshop Item
Language:	en
Published:	2010
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/20364/1/TUE-SE08-05.pdf http://eprints.usm.my/20364/
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