Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire
Nowadays, increasing of gold price and decreasing of dielectric let copper and low-k dielectric materials become a new technology and are increasingly chosen as preferred interconnect insulated material in semiconductor applications. In this paper, a C45 ultra low k wafer technology with bond-over-a...
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| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Conference paper |
| Published: |
2023
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| Subjects: | |
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