K.W, S., Y.B, K., N.A, T., L.W, Y., & 35796107300. (2023). Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer. Elsevier Ltd.
Chicago Style (17th ed.) CitationK.W, Shi, Kar Y.B, Talik N.A, Yew L.W, and 35796107300. Ultraviolet Laser Diode Ablation Process for CMOS 45 Nm Copper Low-K Semiconductor Wafer. Elsevier Ltd, 2023.
MLA (9th ed.) CitationK.W, Shi, et al. Ultraviolet Laser Diode Ablation Process for CMOS 45 Nm Copper Low-K Semiconductor Wafer. Elsevier Ltd, 2023.
Warning: These citations may not always be 100% accurate.
