Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer
Ablation; CMOS integrated circuits; Composite micromechanics; Copper; Design of experiments; Laser ablation; Laser pulses; Micromachining; Pulse repetition rate; Semiconductor diodes; Semiconductor lasers; Silicon wafers; Solid state lasers; Advanced dicing tehcnology; Laser dicing; Laser grooving;...
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| Format: | Conference Paper |
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Elsevier Ltd
2023
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