Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µ...

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Main Authors:	Siti Faqihah, Roduan, Juyana, A. Wahab, Mohd Arif Anuar, Mohd Salleh, Nurul Aida Husna, Mohd Mahayuddin, Mohd Mustafa, Al Bakri Abdullah, Aiman, Mohd Halil, Amira Qistina Syamimi, Zaifuddin, Mahadzir, Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica
Format:	Article
Language:	en
Published:	MDPI 2023
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics
Online Access:	http://umpir.ump.edu.my/id/eprint/38182/1/Effectiveness%20of%20Dimple%20Microtextured%20Copper%20Substrate%20on%20Performance%20of%20Sn-0.7Cu%20Solder%20Alloy.pdf http://umpir.ump.edu.my/id/eprint/38182/ https://doi.org/10.3390/ma16010096
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