Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

In this paper, the nickel–phosphorus (Ni–P) diffusion barrier layer between Sn–4Ag–0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni–P diffusion barrier layer with different percentage of phosphorus content, which are 1–5 wt...

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Bibliographic Details

Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format:	Article
Language:	en en
Published:	Wessex Institute of Technology 2015
Subjects:	TA Engineering (General). Civil engineering (General) TN Mining engineering. Metallurgy
Online Access:	http://umpir.ump.edu.my/id/eprint/11846/1/CMEM030404f.pdf http://umpir.ump.edu.my/id/eprint/11846/7/fkm-2015-aisha-development%20of%20diffusion.pdf http://umpir.ump.edu.my/id/eprint/11846/ http://www.witpress.com/elibrary/cmem-volumes/3/4/1056
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