A. P., P. (2012). A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress.
استشهاد بنمط شيكاغوA. P., Puvanasvaran. A Study On the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.
MLA استشهادA. P., Puvanasvaran. A Study On the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.