APA引文

A. P., P. (2012). A Study on the Effect of Different Interconnection Materials (Wire and Bond Pad) on Ball Bond Strength after Temperature Cycle Stress.

Chicago Style Citation

A. P., Puvanasvaran. A Study On the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.

MLA引文

A. P., Puvanasvaran. A Study On the Effect of Different Interconnection Materials (Wire and Bond Pad) On Ball Bond Strength After Temperature Cycle Stress. 2012.

警告：這些引文格式不一定是100％准確.