APA引文

Pang, S. S. (2020). Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging.

Chicago Style Citation

Pang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.

MLA引文

Pang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.

警告：这些引文格式不一定是100％准确.