Kornain, Z. (2017). Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM).
استشهاد بنمط شيكاغوKornain, Z. Temperature & Zincation Process Effect On Electrical Resistivity of Aluminum Bond Pad for Under Bump Metallurgy (UBM). 2017.
MLA استشهادKornain, Z. Temperature & Zincation Process Effect On Electrical Resistivity of Aluminum Bond Pad for Under Bump Metallurgy (UBM). 2017.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.