APA引文

Kornain, Z. (2017). Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM).

Chicago Style Citation

Kornain, Z. Temperature & Zincation Process Effect On Electrical Resistivity of Aluminum Bond Pad for Under Bump Metallurgy (UBM). 2017.

MLA引文

Kornain, Z. Temperature & Zincation Process Effect On Electrical Resistivity of Aluminum Bond Pad for Under Bump Metallurgy (UBM). 2017.

警告：这些引文格式不一定是100％准确.