APA Citation

Jiun, H. (2017). Alternative double pass dicing method for thin wafer laminated with die attach film.

Chicago Style Citation

Jiun, H.H. Alternative Double Pass Dicing Method for Thin Wafer Laminated With Die Attach Film. 2017.

MLA Citation

Jiun, H.H. Alternative Double Pass Dicing Method for Thin Wafer Laminated With Die Attach Film. 2017.

Warning: These citations may not always be 100% accurate.