Jiun, H. (2017). Alternative double pass dicing method for thin wafer laminated with die attach film.
استشهاد بنمط شيكاغوJiun, H.H. Alternative Double Pass Dicing Method for Thin Wafer Laminated With Die Attach Film. 2017.
MLA استشهادJiun, H.H. Alternative Double Pass Dicing Method for Thin Wafer Laminated With Die Attach Film. 2017.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.